Thermal Isolation

For placing between base plate and substrate

Low thermal conductivity:

0,06 W/mK

High compressive strength:

10 N/mm²

Combi / Combi Modular / Variant Modular 160 x 160 /
Variant Modular 370 x 370 / Variant-K 4 pcs each

Variant Modular 300 x 300 - 8 pcs each

Art. No.

Description

4608001

Thermal isolation